Documents checklist:

1. Project name with a revision number. (PCBA) 2. Gerber files with panel layout, PCB factory, etc. 3. Preferably with IPC net list for subsequent verification. 4. Specification of the PCB. 5. WishesRequests for regarding solder paste, cleaning, coating, glue etc. 6. FABMASTER, ASCII or ODB++ files for the AEGIS production suite. 7. Special instructions for specific components. 8. Bill of Material (BOM) in Excel.

I uploaded all related documents

Documents checklist:

1. Project name with a revision number. (PCBA) 2. Gerber files with panel layout, PCB factory, etc. 3. Preferably with IPC net list for subsequent verification. 4. Specification of the PCB. 5. WishesRequests for regarding solder paste, cleaning, coating, glue etc. 6. FABMASTER, ASCII or ODB++ files for the AEGIS production suite. 7. Special instructions for specific components. 8. Bill of Material (BOM) in Excel.

I uploaded all related documents

Documents checklist:

1. Project name with a revision number. (PCBA) 2. Gerber files with panel layout, PCB factory, etc. 3. Preferably with IPC net list for subsequent verification. 4. Specification of the PCB. 5. WishesRequests for regarding solder paste, cleaning, coating, glue etc. 6. FABMASTER, ASCII or ODB++ files for the AEGIS production suite. 7. Special instructions for specific components. 8. Bill of Material (BOM) in Excel.

I uploaded all related documents

Bill of Material (BOM) in Excel, including:

BOM revisionQuantity of the relevant componentReference (R16, U3, X1, etc.)Component type (resistor, IC, etc.)
Type (e.g. ADUC832BRZ)Value (e.g. 100nF, 100k, etc.)Specification (%, V, W, ppm, C0G/X7R, Low ESR, 105 ºCManufacturer (e.g. Texas Instruments)
alternative componentsSMD / conventionalfull descriptionResource Type Style (SMT/TH/MECH)
Package size (e.g. 0603 or TO220)Preferably for micro BGA, QFN, LGA the pitchWhen supplied: specify type and size of the reel/ tape/ stick, etc.